US Patent Application No: 2012/0092,090

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COUPLING STRUCTURE FOR MULTI-LAYERED CHIP FILTER, AND MULTI-LAYERED CHIP FILTER WITH THE STRUCTURE

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Abstract

Disclosed herein are a coupling structure for a multi-layered chip filter capable of overcoming a limitation of an existing coupling by improving a coupling structure and a multi-layered chip filter with the structure.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SAMSUNG ELECTRO-MECHANICS CO., LTD.GYUNGGI-DO1995

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AHN, Young Ghyu - 21 0
LIM, Bong Sup - 8 0
Park, Dong Seok Seoul, KR 86 155
Park, Sang Soo Kyungki-do, KR 94 227
Park, Sung Jin Koyang-si, KR 38 33
Park, Young Sun Asan-si, KR 11 2

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