METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
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United States of America Patent
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Issued Date -
Apr 19, 2012
app pub date -
Oct 15, 2010
filing date -
Oct 15, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.
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