HALOGEN- AND PHOSPHORUS-FREE THERMOSETTING RESIN COMPOSITION

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United States of America Patent

APP PUB NO 20120095132A1
SERIAL NO

12907364

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Abstract

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A halogen- and phosphorus-free thermosetting resin composition is provided, which is mainly a varnish resin formed by mixing a mixture of two curing agents, an epoxy resin mixture, and an inorganic additive. The mixture of two curing agents is formed by mixing a phenolphthalein modified benzoxazine phenol aldehyde curing agent and an amino triazine novolak, and the epoxy resin mixture is formed by mixing an epoxy resin having an oxazolidone ring or a polyamide-imide-modified epoxy resin and a Bisphenol F epoxy resin.

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Patent Owner(s)

Patent OwnerAddress
UNIPLUS ELECTRONICS CO LTDNO 38-1 TUNG YUAN RD CHUNG-LI INDUSTRIAL PARK TAOYUAN HSIEN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, Chung-Hao Taoyuan Hsien, TW 26 55
Lin, Hui-Min Taoyuan Hsien, TW 9 107
Yeh, Chia-Hsiu Taoyuan Hsien, TW 5 21

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