Importance

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Abstract

Described is equipment for depositing materials by evaporation using a molecular beam and equipment for fabricating semiconductor wafers, including a central conveyor module having a plurality of lateral ports capable of functioning under vacuum pressure conditions above 10⁻⁸ Torr. The semiconductor wafer fabrication equipment includes a loader module and one or more substrate treatment modules functioning under vacuum pressure conditions above 10⁻⁸ Torr, each treatment module being connected to one of the ports of the central conveyor module. The fabrication equipment includes at least one module for depositing materials by evaporation using a molecular beam operating under vacuum pressure conditions below 10⁻⁸ Torr, the molecular beam deposition module being connected to one of the ports of the central conveyor module and being capable of receiving the substrate in order to deposit a layer of materials on its face to be treated.

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First Claim