Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same

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United States of America Patent

APP PUB NO 20120097437A1
SERIAL NO

13006530

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Abstract

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A resin composition is provided. The resin composition comprises:

    an epoxy resin;a polymer solution as a hardener, which is prepared by the following steps: (a) dissolving an N,O-heterocyclic compound into a first solvent to form a first reaction solution, wherein the N,O-heterocyclic compound is of Formula I or Formula II:

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Patent Owner(s)

Patent OwnerAddress
LIAO SHIH-HAONO 7 ALY 24 LN 72 GUANGHUA 2ND ST NORTH DIST HSINCHU CITY
TAIWAN UNION TECHNOLOGY CORPORATIONNO 803 PO AI ST ZHUBEI CITY HSINCHU COUNTY TAIWAN R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsien-Te Chupei City, TW 54 134
Hsu, Hsuan-Hao Chupei Cit, TW 12 40
Liao, Chih-Wei Chupei City, TW 70 210
Liao, Shih-Hao Chupei City, TW 6 10
Lin, Tsung-Hsien Chupei City, TW 93 385

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