SEMICONDUCTOR DEVICE FOR PROVIDING HEAT MANAGEMENT

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United States of America Patent

APP PUB NO 20120104346A1
SERIAL NO

12916414

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device for providing heat management may include a first electrode with low metal thermal conductivity and a second electrode with low metal thermal conductivity. A metal oxide structure which includes a transition metal oxide (TMO) may be electrically coupled to the first electrode and second electrode and the metal oxide structure may be disposed between the first electrode and second electrode. An electrically insulating sheath with low thermal conductivity may surround the metal oxide structure.

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Patent Owner(s)

Patent OwnerAddress
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP1701 EAST MOSSY OAKS ROAD SPRING TX 77389

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pickett, Matthew D San Francisco, US 58 550
Ribeiro, Gilberto Medeiros Menlo Park, US 38 313
Yi, Wei Mountain View, US 52 311

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