WHITE CERAMIC LED PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120104426A1
SERIAL NO

12939096

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Abstract

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The present invention is directed to leadless LED packages and LED displays utilizing white ceramic casings and thin/low profile packages with improved color mixing and structural integrity. In some embodiments, the improved color mixing is provided, in part, by the white ceramic package casing, which can help reflect light emitted from each LED in many directions away from the device. The non-linear arrangement of the LEDs can also contribute to improved color-mixing. The improved structural integrity can be provided by various features in the bond pads that cooperate with the casing for a stronger package structure. Moreover, in some embodiments the thinness/low profile of each package is attributed to its leadless structure, with the bond pads and electrodes electrically connected via through-holes. In some embodiments, the structural integrity of the package can also be attributed to indentations along its sides, which do not enable as much plating material to accumulate at the sides and helps package cutting processes during manufacture. The indentations can also contribute to displays having more tightly and densely packed LED arrays.

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Patent Owner(s)

Patent OwnerAddress
CREELED INC4400 SILICON DRIVE DURHAM NC 27703

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Alex Chi Keung Sheung Shui, HK 9 200
Lau, Victor Yue Kwong Hong Kong, CN 5 154
Pang, Charles Chak Hau Fanling, HK 7 96

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