US Patent Application No: 2012/0104,583

Number of patents in Portfolio can not be more than 2000

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME

ALSO PUBLISHED AS: 8519519

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FREESCALE SEMICONDUCTOR, INC.AUSTIN, TX7619

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Beng Siong - 2 0
Teh, Guat Kew - 2 0
Wong, Wai Keong - 11 2

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