US Patent Application No: 2012/0104,583

Number of patents in Portfolio can not be more than 2000

SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME

ALSO PUBLISHED AS: 8519519

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FREESCALE SEMICONDUCTOR, INC.AUSTIN, TX5759

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Beng Siong - 2 0
Teh, Guat Kew - 2 0
Wong, Wai Keong - 11 4

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SANYO ELECTRIC CO., LTD. (2)
* 7,208,826 Semiconductor device and method of manufacturing the same 20 2001
* 7,476,972 Circuit device, manufacturing method thereof, and sheet-like board member 7 2005
 
STATS CHIPPAC LTD. (2)
* 8,163,604 Integrated circuit package system using etched leadframe 3 2005
* 7,759,806 Integrated circuit package system with multiple device units 3 2007
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
* 6,927,480 Multi-chip package with electrical interconnection 6 2004
 
GIGNO TECHNOLOGY CO., LTD. (1)
* 6,759,753 Multi-chip package 9 2003
 
INTEL CORPORATION (1)
* 7,800,225 Microelectronic die including locking bump and method of making same 3 2007
 
MITSUI CHEMICALS, INC. (1)
* 5,639,990 Solid printed substrate and electronic circuit package using the same 196 1994
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 2002/0031,856 Repairable multi-chip package and high-density memory card having the package 1 2001
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
* 6,677,672 Structure and method of forming a multiple leadframe semiconductor device 16 2002
 
SHARP KABUSHIKI KAISHA (1)
* 7,358,599 Optical semiconductor device having a lead frame and electronic equipment using same 7 2005
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (1)
* 6,545,332 Image sensor of a quad flat package 199 2001
* Cited By Examiner

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