Semiconductor device having die pads isolated from interconnect portion and method of assembling same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8519519
APP PUB NO 20120104583A1
SERIAL NO

12938376

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Abstract

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A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
NXP USA, INC.AUSTIN, TX4882

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Beng Siong Ampang, MY 1 3
Teh, Guat Kew Subang Jaya, MY 2 3
Wong, Wai Keong Shah Alam, MY 12 16

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 7358599 Optical semiconductor device having a lead frame and electronic equipment using same 8 2005
 
SANYO ELECTRIC CO., LTD. (2)
* 7208826 Semiconductor device and method of manufacturing the same 24 2001
* 7476972 Circuit device, manufacturing method thereof, and sheet-like board member 9 2005
 
GIGNO TECHNOLOGY CO., LTD. (1)
* 6759753 Multi-chip package 9 2003
 
STATS CHIPPAC PTE. LTE. (2)
* 8163604 Integrated circuit package system using etched leadframe 4 2005
* 7759806 Integrated circuit package system with multiple device units 3 2007
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
5328079 Method of and arrangement for bond wire connecting together certain integrated circuit components 76 1993
 
INTEL CORPORATION (1)
* 7800225 Microelectronic die including locking bump and method of making same 3 2007
 
FREESCALE SEMICONDUCTOR, INC. (1)
5468999 Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding 210 1994
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
* 6677672 Structure and method of forming a multiple leadframe semiconductor device 17 2002
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (1)
* 6545332 Image sensor of a quad flat package 237 2001
 
SAMSUNG ELECTRONICS CO., LTD. (1)
* 2002/0031,856 Repairable multi-chip package and high-density memory card having the package 1 2001
 
AGILENT TECHNOLOGIES, INC. (1)
5723906 High-density wirebond chip interconnect for multi-chip modules 49 1996
 
NORTH STAR INNOVATIONS INC. (1)
7014888 Method and structure for fabricating sensors with a sacrificial gel dome 15 2002
 
INFINEON TECHNOLOGIES AG (1)
2006/0053,895 Pressure sensor apparatus and method of producing the same 2 2005
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (1)
* 6927480 Multi-chip package with electrical interconnection 6 2004
 
MITSUI CHEMICALS, INC. (1)
* 5639990 Solid printed substrate and electronic circuit package using the same 217 1994
* Cited By Examiner

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