Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8813515
APP PUB NO 20120111027A1
SERIAL NO

12939574

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY44232

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campbell, Levi A Poughkeepsie, US 260 3896
Chu, Richard C Hopewell Junction, US 300 7690
Ellsworth,, Jr Michael J Lagrangeville, US 227 2633
Iyengar, Madhusudan K Woodstock, US 306 4917
Simons, Robert E Poughkeepsie, US 302 7258

Cited Art Landscape

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