US Patent Application No: 2012/0111,027

Number of patents in Portfolio can not be more than 2000

THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION APPARATUS FACILITATING COOLING OF AN ELECTRONIC COMPONENT

ALSO PUBLISHED AS: 8813515
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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY45783

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campbell, Levi A Poughkeepsie, NY 344 1695
Chu, Richard C Hopewell Junction, NY 448 4515
Ellsworth,, Jr Michael J - 256 952
Iyengar, Madhusudan K Woodstock, NY 450 2137
Simons, Robert E Pouhkeepsie, NY 425 4338

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 2007/0044,493 Systems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene 7 2005
* 2009/0126,909 SYSTEM AND METHOD FOR FACILITATING COOLING OF A LIQUID-COOLED ELECTRONICS RACK 18 2007
 
LENOVO INTERNATIONAL LIMITED (1)
* 7,963,119 Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center 15 2007
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (4)
8,899,052 Thermoelectric-enhanced, refrigeration cooling of an electronic component 0 2010
8,833,096 Heat exchange assembly with integrated heater 0 2010
8,783,052 Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling 0 2010
8,789,385 Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component 0 2012
 
MICROSOFT CORPORATION (1)
* 8,712,598 Adaptive flow for thermal cooling of devices 0 2011
* Cited By Examiner