US Patent Application No: 2012/0111,027

Number of patents in Portfolio can not be more than 2000

THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION APPARATUS FACILITATING COOLING OF AN ELECTRONIC COMPONENT

ALSO PUBLISHED AS: 8813515

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY45990

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campbell, Levi A Poughkeepsie, NY 377 1984
Chu, Richard C Hopewell Junction, NY 475 4931
Ellsworth,, Jr Michael J - 290 1215
Iyengar, Madhusudan K Woodstock, NY 481 2513
Simons, Robert E Pouhkeepsie, NY 452 4745

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 2007/0044,493 Systems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene 10 2005
* 2009/0126,909 SYSTEM AND METHOD FOR FACILITATING COOLING OF A LIQUID-COOLED ELECTRONICS RACK 27 2007
 
LENOVO INTERNATIONAL LIMITED (1)
* 7,963,119 Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center 20 2007
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (6)
8,955,346 Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load 0 2010
8,899,052 Thermoelectric-enhanced, refrigeration cooling of an electronic component 0 2010
8,833,096 Heat exchange assembly with integrated heater 0 2010
8,783,052 Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling 0 2010
8,789,385 Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component 0 2012
8,925,333 Thermoelectric-enhanced air and liquid cooling of an electronic system 0 2012
 
MICROSOFT TECHNOLOGY LICENSING, LLC (2)
* 8,712,598 Adaptive flow for thermal cooling of devices 0 2011
* 2012/0182,687 ADAPTIVE THERMAL MANAGEMENT FOR DEVICES 0 2011
 
LIEBERT CORPORATION (1)
* 2013/0098,085 HIGH EFFICIENCY COOLING SYSTEM 0 2012
* Cited By Examiner