US Patent Application No: 2012/0111,027

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THERMOELECTRIC-ENHANCED, VAPOR-COMPRESSION REFRIGERATION APPARATUS FACILITATING COOLING OF AN ELECTRONIC COMPONENT

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a refrigerant loop, a compressor coupled to the refrigerant loop, and a controllable thermoelectric array disposed in thermal communication with the refrigerant loop. Refrigerant flowing through the refrigerant loop facilitates dissipation of heat from the electronic component, and the thermoelectric array is disposed with a first portion of the refrigerant loop, residing upstream of the compressor, in thermal contact with a first side of the array, and a second portion of the refrigerant loop, residing downstream of the compressor, in thermal contact with a second side of the array. The thermoelectric array ensures that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state by transferring heat from refrigerant passing through the second portion to refrigerant passing through the first portion of the refrigerant loop.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY73247

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campbell, Levi A Poughkeepsie, NY 297 1298
Chu, Richard C Hopewell Junction, NY 407 3916
Ellsworth,, Jr Michael J - 211 636
Iyengar, Madhusudan K Woodstock, NY 407 1566
Simons, Robert E Pouhkeepsie, NY 385 3728

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