Vialess integration for dual thin films—thin film resistor and heater
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United States of America Patent
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Oct 15, 2013
Grant Date -
May 10, 2012
app pub date -
Dec 29, 2011
filing date -
Sep 17, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

First Claim
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | Total Patents |
---|---|---|
STMICROELECTRONICS (GRENOBLE 2) SAS | GRENOBLE CEDEX, FR | 172 |
STMICROELECTRONICS LIMITED | UTTAR PRADESH | 412 |
STMICROELECTRONICS S.R.L. | AGRATE BRIANZA, MI | 3136 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Castorina, MaurizoGabriele | Catania, IT | 1 | 3 |
Dumont-Girard, Pascale | St Joseph de Riviere, FR | 3 | 49 |
Le, Neel Olivier | Singapore, SG | 59 | 345 |
Leung, Calvin | Singapore, SG | 17 | 106 |
Privitera, Stefania Maria Serena | Catania, IT | 6 | 20 |
Cited Art Landscape
Patent Info | (Count) | # Cites | Year |
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2003/0155,591 Field effect transistor and method for producing a field effect transistor | 10 | 2003 | |
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7338637 Microfluidic device with thin-film electronic devices | 46 | 2003 | |
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2004/0021,740 Heater chip configuration for an inkjet printhead and printer | 8 | 2003 | |
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* 5635893 Resistor structure and integrated circuit | 36 | 1995 | |
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5503878 Method of preparing thin film resistors | 27 | 1994 | |
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5135888 Field effect device with polycrystalline silicon channel | 28 | 1990 | |
5640023 Spacer-type thin-film polysilicon transistor for low-power memory devices | 25 | 1995 | |
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5821960 Ink jet recording head having first and second connection lines | 20 | 1996 | |
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2012/0049,323 LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR | 9 | 2010 | |
2012/0049,324 MULTI-LAYER VIA-LESS THIN FILM RESISTOR | 8 | 2010 | |
2012/0049,997 VIA-LESS THIN FILM RESISTOR WITH A DIELECTRIC CAP | 8 | 2010 | |
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6891747 Phase change memory cell and manufacturing method thereof using minitrenches | 28 | 2003 | |
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5623097 Thermal-type flow sensor | 28 | 1994 | |
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2005/0052,498 Tapered multi-layer thermal actuator and method of operating same | 11 | 2004 | |
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7259040 Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby | 24 | 2004 | |
2007/0189,053 ELECTRICAL FUSE DEVICE BASED ON A PHASE-CHANGE MEMORY ELEMENT AND CORRESPONDING PROGRAMMING METHOD | 22 | 2007 | |
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7427926 Establishing communication between computing-based devices through motion detection | 113 | 2006 | |
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5037766 Method of fabricating a thin film polysilicon thin film transistor or resistor | 82 | 1990 | |
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6504226 Thin-film transistor used as heating element for microreaction chamber | 31 | 2001 | |
* 8242876 Dual thin film precision resistance trimming | 15 | 2009 | |
2010/0073,122 DUAL THIN FILM PRECISION RESISTANCE TRIMMING | 22 | 2009 | |
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2012/0168,754 THIN FILM METAL-DIELECTRIC-METAL TRANSISTOR | 10 | 2010 | |
2012/0170,352 THERMO PROGRAMMABLE RESISTOR BASED ROM | 15 | 2010 |
Patent Citation Ranking
Forward Cite Landscape
Patent Info | (Count) | # Cites | Year |
---|---|---|---|
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* 9870851 Low temperature fabrication of lateral thin film varistor | 0 | 2016 | |
9865674 Low temperature fabrication of lateral thin film varistor | 0 | 2016 | |
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* 9825141 Three dimensional monolithic LDMOS transistor | 0 | 2015 |
Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Apr 15, 2021 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Apr 15, 2025 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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