Vialess integration for dual thin films—thin film resistor and heater

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8558654
APP PUB NO 20120112873A1
SERIAL NO

13340255

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Abstract

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A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS (GRENOBLE 2) SASGRENOBLE CEDEX, FR69
STMICROELECTRONICS LIMITEDUTTAR PRADESH521
STMICROELECTRONICS S.R.L.AGRATE BRIANZA, MI2888

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Castorina, MaurizoGabriele Catania, IT 1 0
Dumont-Girard, Pascale St Joseph de Riviere, FR 3 45
Le, Neel Olivier Singapore, SG 54 277
Leung, Calvin Singapore, SG 15 92
Privitera, Stefania Maria Serena Catania, IT 6 13

Cited Art Landscape

Patent Info (Count) # Cites Year
 
POLARIS INNOVATIONS LIMITED (1)
2003/0155,591 Field effect transistor and method for producing a field effect transistor 10 2003
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
7338637 Microfluidic device with thin-film electronic devices 44 2003
 
FUNAI ELECTRIC CO., LTD. (1)
2004/0021,740 Heater chip configuration for an inkjet printhead and printer 6 2003
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5635893 Resistor structure and integrated circuit 36 1995
 
Nippondenso Co., Ltd. (1)
5503878 Method of preparing thin film resistors 27 1994
 
SGS-THOMSON MICROELECTRONICS, INC. (2)
5135888 Field effect device with polycrystalline silicon channel 28 1990
5640023 Spacer-type thin-film polysilicon transistor for low-power memory devices 25 1995
 
FUJI PHOTO FILM CO., LTD. (1)
5821960 Ink jet recording head having first and second connection lines 18 1996
 
OVONYX MEMORY TECHNOLOGY, LLC (1)
6891747 Phase change memory cell and manufacturing method thereof using minitrenches 27 2003
 
RICOH COMPANY, LTD. (1)
5623097 Thermal-type flow sensor 27 1994
 
CITICORP NORTH AMERICA, INC. (1)
2005/0052,498 Tapered multi-layer thermal actuator and method of operating same 11 2004
 
STMICROELECTRONICS (CROLLES 2) SAS (2)
* 8242876 Dual thin film precision resistance trimming 15 2009
2010/0073,122 DUAL THIN FILM PRECISION RESISTANCE TRIMMING 21 2009
 
STMICROELECTRONICS S.R.L. (2)
7259040 Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array manufactured thereby 24 2004
2007/0189,053 ELECTRICAL FUSE DEVICE BASED ON A PHASE-CHANGE MEMORY ELEMENT AND CORRESPONDING PROGRAMMING METHOD 21 2007
 
MICROSOFT TECHNOLOGY LICENSING, LLC (1)
7427926 Establishing communication between computing-based devices through motion detection 97 2006
 
TOPPOLY OPTOELECTRONICS CORP. (1)
5037766 Method of fabricating a thin film polysilicon thin film transistor or resistor 82 1990
 
STMICROELECTRONICS, INC. (1)
6504226 Thin-film transistor used as heating element for microreaction chamber 30 2001
 
STMICROELECTRONICS LIMITED (5)
2012/0049,323 LATERAL CONNECTION FOR A VIA-LESS THIN FILM RESISTOR 9 2010
2012/0049,324 MULTI-LAYER VIA-LESS THIN FILM RESISTOR 8 2010
2012/0049,997 VIA-LESS THIN FILM RESISTOR WITH A DIELECTRIC CAP 7 2010
2012/0168,754 THIN FILM METAL-DIELECTRIC-METAL TRANSISTOR 10 2010
2012/0170,352 THERMO PROGRAMMABLE RESISTOR BASED ROM 13 2010
* Cited By Examiner

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