US Patent Application No: 2012/0112,873

Number of patents in Portfolio can not be more than 2000

VIALESS INTEGRATION FOR DUAL THIN FILMS - THIN FILM RESISTOR AND HEATER

ALSO PUBLISHED AS: 8558654

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Abstract

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A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS PVT. LTD.UTTAR PRADESH716
STMICROELECTRONICS (ROUSSET) SASCROLLES408
STMICROELECTRONICS S.R.L.AGRATE BRIANZA, MI2436

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Castorina, Maurizio Gabriele - 1 0
Dumont-Girard, Pascale - 6 16
Le, Neel Olivier Le Cellier, FR 54 73
Leung, Calvin - 13 33
PRIVITERA, Stefania Maria Serena - 8 3

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