US Patent Application No: 2012/0112,873

Number of patents in Portfolio can not be more than 2000

VIALESS INTEGRATION FOR DUAL THIN FILMS - THIN FILM RESISTOR AND HEATER

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Abstract

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A process is described for integrating two closely spaced thin films without deposition of the films through deep vias. The films may be integrated on a wafer and patterned to form a microscale heat-trimmable resistor. A thin-film heating element may be formed proximal to a thin-film resistive element, and heat generated by the thin-film heater can be used to permanently trim a resistance value of the thin-film resistive element. Deposition of the thin films over steep or abrupt topography is minimized by using a process in which the thin films are deposited in a sequence that falls between depositions of thick metal contacts to the thin films.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
STMICROELECTRONICS PVT. LTD.UTTAR PRADESH815
STMICROELECTRONICS (CROLLES 2) SASCROLLES770
STMICROELECTRONICS S.R.L.AGRATE BRIANZA, MI2767

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Castorina, Maurizio Gabriele Nicolosi, IT 1 0
Dumont-Girard, Pascale Les Grollets, FR 3 43
Le, Neel Olivier Singapore, SG 54 237
Leung, Calvin Singapore, SG 15 89
Privitera, Stefania Maria Serena Catania, IT 6 11

Cited Art Landscape

Patent Info (Count) # Cites Year
 
STMICROELECTRONICS (CROLLES 2) SAS (1)
* 8,242,876 Dual thin film precision resistance trimming 15 2009
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 5,635,893 Resistor structure and integrated circuit 36 1995
* Cited By Examiner

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