US Patent Application No: 2012/0115,259

METHOD FOR FABRICATING FLEXIBLE ELECTRONIC DEVICE AND ELECTRONIC DEVICE FABRICATED THEREBY

Stats

May 10, 2012
Publication date
Nov 9, 2011
filing date
13/292,772
serial no
Published
status

Importance

Loading Importance Indicators... loading....

Abstract

Disclosed are a method for fabricating a flexible electronic device using laser lift-off and an electronic device fabricated thereby. More particularly, disclosed are a method for fabricating a flexible electronic device using laser lift-off allowing for fabrication of a flexible electronic device in an economical and stable way by separating a device such as a secondary battery fabricated on a sacrificial substrate using laser, and an electronic device fabricated thereby.

Loading the Abstract Image... loading....

First Claim

loading....

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent Owner	Address	Total Patents
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY	DAEJEON	924

International Classification(s)

[Classification Symbol]

[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Hwang, Geon Tae	-	3	0
Koo, Min	-	2	0
Lee, Keon Jae	Savoy, IL	30	208

Patent Citation Ranking

Forward Cites

No Forward Cites to Display

Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
3.5 Year Payment	$1600.00	$800.00	$400.00	Nov 10, 2015
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 10, 2019
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 10, 2023

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 3.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00