ELECTRODE BASE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120118609A1
SERIAL NO

13379470

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electrode base in which a lead wire made of aluminum is bonded to a surface of a glass substrate that is a thin-film base having a plate thickness of about 0.7 to 2.0 mm, by using an ultrasonic bonding method. An external lead-out electrode made of copper is formed so as to extend from a surface of one end portion of the lead wire to a region outside the glass substrate. The lead wire functions as an internal signal receiver, and the external lead-out electrode has an external signal transmission function.

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Patent Owner(s)

Patent OwnerAddress
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION3-1-1 KYOBASHI CHUO-KU TOKYO 104-0031

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kogura, Masahisa Tokyo, JP 6 38
Yoshida, Akio Tokyo, JP 109 1344

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