NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE RESIN FILM USING SAME, AND FLEXIBLE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Jul 21, 2010
filing date -
Jul 27, 2009
priority date (Note) -
Abandoned
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Abstract
A negative photosensitive resin composition contains a polyimide precursor resin obtained by condensation polymerization of a carboxylic anhydride component containing an aromatic tetracarboxylic dianhydride and a diamine component containing an aromatic diamine, a photopolymerizable monomer, and a photopolymerization initiator, wherein a compound having a photoreactive functional group and a glycidyl group is contained as the photopolymerizable monomer in an amount of 0.05% to 15% by weight relative to the total solid content of the negative photosensitive resin composition. Accordingly, a negative photosensitive resin composition is provided in which non-exposed areas have excellent solubility in a developing solution and degradation of the film located in exposed areas, the degradation being caused by the developing solution, is suppressed. Also provided are a printed circuit board and a polyimide film using the negative photosensitive resin composition.
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