ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Nov 11, 2010
filing date -
Nov 11, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads are designed to possess incurved sidewalls for enhancing the adhesion between the inner leads and the surrounding molding compound.
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