INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Nov 15, 2010
filing date -
Nov 15, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base bottom side and a base top side; mounting an integrated circuit perpendicular to the base top side, the integrated circuit having a first conductor partially exposed at a first end facing and connected to the base top side; and forming an encapsulation over the integrated circuit.
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