Multilayer structure comprising a precious metal stuck onto a dielectric substrate, and an associated method and use
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United States of America Patent
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Issued Date -
May 17, 2012
app pub date -
Oct 12, 2011
filing date -
Oct 12, 2010
priority date (Note) -
Abandoned
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Abstract
The invention provides a multilayer structure comprising a dielectric substrate; a sticking layer that extends over a first face of the dielectric substrate; at least one layer of precious metal placed on the sticking layer, said sticking layer comprising a derivative of an alkylsilane, the layer of precious metal being applied by evaporation or by sputtering said precious metal.
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