ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jun 23, 2009
filing date -
Jun 23, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 μm or less.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully