PACKAGE STRUCTURE
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United States of America Patent
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N/A
Issued Date -
May 24, 2012
app pub date -
Sep 14, 2011
filing date -
Nov 23, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention employs tie bar(s) of a lead frame as contact(s) so as to increase the number of contacts in a package structure. Therefore, a die can be packaged in a package structure with a smaller dimension to lower packaging cost of an integrated circuit.
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