THERMOSETTING RESIN COMPOSITION AND PREPREG OR LAMINATE USING THE SAME
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United States of America Patent
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Issued Date -
May 24, 2012
app pub date -
Nov 24, 2010
filing date -
Nov 24, 2010
priority date (Note) -
Abandoned
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Abstract
A thermosetting resin composition and a prepreg or laminate using the same are provided. The thermosetting resin composition includes an epoxy resin and a curing agent, in which the curing agent is a dual-curing agent system formed with a multi-functional aromatic polyester curing agent in combination with a phenolphthalein benzoxazine phenol aldehyde or a poly(styrene-co-maleic anhydride). An organic or inorganic fiber reinforced material is impregnated with the thermosetting resin composition to form a prepreg, and the prepreg is bonded to a substrate with a metal foil disposed thereon, to form a laminate.
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