METHOD AND APPARATUS FOR REDUCING TAPER OF LASER SCRIBES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 20120132629
APP PUB NO 20120132629A1
SERIAL NO

12957265

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatuses for reducing taper of a laser scribe in a substrate are described. One method includes aiming a laser beam at a surface of the substrate in a first direction perpendicular to a first cutting direction of the beam and aiming it at the surface in a second direction perpendicular to the first cutting direction. In each position, the laser beam is tilted at a beam tilt angle with respect to a line perpendicular to the surface. A single scribe line is formed in the surface by applying the laser beam to the surface while aiming the laser beam in the first direction and cutting in the first cutting direction and applying the laser beam to the surface while aiming the laser beam in the second direction and cutting in one of the first cutting direction and a second cutting direction opposite the first cutting direction.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR422

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frankel, Joseph G Beaverton, US 3 0
O'Brien, James N Bend, US 10 435

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2004/0164,060 HOLE DRILLING METHOD AND APPARATUS 9 2004
 
PANASONIC CORPORATION (2)
* 8338745 Apparatus and methods for drilling holes with no taper or reverse taper 0 2009
* 2011/0132,881 APPARATUS AND METHODS FOR DRILLING HOLES WITH NO TAPER OR REVERSE TAPER 0 2009
 
DISCO CORPORATION (4)
* 2005/0070,075 Laser beam processing method and laser beam machine 0 2004
* 7364986 Laser beam processing method and laser beam machine 86 2004
* 2005/0277,270 Wafer processing method 6 2005
* 7473866 Laser processing apparatus 88 2006
 
Anstalt Gersan (1)
* 5194711 Cutting using high energy radiation 6 1991
 
HAMAMATSU PHOTONICS K.K. (1)
* 6992026 Laser processing method and laser processing apparatus 186 2003
 
ADVANCED DICING TECHNOLOGIES, LTD. (2)
* 6420245 Method for singulating semiconductor wafers 52 2001
* 2002/0031,899 Apparatus and method for singulating semiconductor wafers 36 2001
 
ROLLS-ROYCE PLC (1)
* 4992025 Film cooled components 49 1989
 
TECHNOLINES, LLC (1)
* 5916461 System and method for processing surfaces by a laser 29 1997
 
INTEL CORPORATION (1)
* 8364304 Methods and apparatus for laser scribing wafers 2 2010
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
* 4941082 Light beam positioning system 41 1988
* 6586707 Control of laser machining 24 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5059759 Laser beam machine 16 1990
 
ROHM CO., LTD. (1)
* 7939429 Nitride semiconductor device and method of manufacturing the same 0 2008
 
LOCKHEED MARTIN CORPORATION (1)
* 4894115 Laser beam scanning method for forming via holes in polymer materials 150 1989
 
CATERPILLAR INC. (1)
* 2009/0057,282 Laser machining method utilizing variable inclination angle 4 2008
 
SOLYNDRA LLC (1)
* 2008/0029,152 Laser scribing apparatus, systems, and methods 73 2006
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 6772514 Method of machining glass substrate and method fabricating high-frequency circuit 6 2001
* 2004/0017,430 Laser processing method and laser processing apparatus 6 2003
 
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (1)
* 2010/0320,179 Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same 4 2008
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
CORNING INCORPORATED (1)
* 2015/0059,411 METHOD OF SEPARATING A GLASS SHEET FROM A CARRIER 0 2014
* Cited By Examiner