US Patent Application No: 2012/0132,629

Number of patents in Portfolio can not be more than 2000

METHOD AND APPARATUS FOR REDUCING TAPER OF LASER SCRIBES

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatuses for reducing taper of a laser scribe in a substrate are described. One method includes aiming a laser beam at a surface of the substrate in a first direction perpendicular to a first cutting direction of the beam and aiming it at the surface in a second direction perpendicular to the first cutting direction. In each position, the laser beam is tilted at a beam tilt angle with respect to a line perpendicular to the surface. A single scribe line is formed in the surface by applying the laser beam to the surface while aiming the laser beam in the first direction and cutting in the first cutting direction and applying the laser beam to the surface while aiming the laser beam in the second direction and cutting in one of the first cutting direction and a second cutting direction opposite the first cutting direction.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR384

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frankel, Joseph G - 4 0
O'Brien, James N Bend, OR 12 250

Cited Art Landscape

Patent Info (Count) # Cites Year
 
DISCO CORPORATION (4)
* 2005/0070,075 Laser beam processing method and laser beam machine 2004
* 7,364,986 Laser beam processing method and laser beam machine 20 2004
* 2005/0277,270 Wafer processing method 2 2005
* 7,473,866 Laser processing apparatus 21 2006
 
ADVANCED DICING TECHNOLOGIES, LTD. (2)
* 2002/0031,899 Apparatus and method for singulating semiconductor wafers 31 2001
* 6,420,245 Method for singulating semiconductor wafers 46 2001
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
* 4,941,082 Light beam positioning system 41 1988
* 6,586,707 Control of laser machining 20 2001
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 6,772,514 Method of machining glass substrate and method fabricating high-frequency circuit 2 2001
* 2004/0017,430 Laser processing method and laser processing apparatus 4 2003
 
PANASONIC CORPORATION (2)
* 2011/0132,881 APPARATUS AND METHODS FOR DRILLING HOLES WITH NO TAPER OR REVERSE TAPER 0 2009
* 8,338,745 Apparatus and methods for drilling holes with no taper or reverse taper 0 2009
 
ANSTALT GERSAN (1)
* 5,194,711 Cutting using high energy radiation 6 1991
 
CATERPILLAR INC. (1)
* 2009/0057,282 Laser machining method utilizing variable inclination angle 1 2008
 
HAMAMATSU PHOTONICS K.K. (1)
* 6,992,026 Laser processing method and laser processing apparatus 134 2003
 
INTEL CORPORATION (1)
* 8,364,304 Methods and apparatus for laser scribing wafers 0 2010
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 2004/0164,060 HOLE DRILLING METHOD AND APPARATUS 7 2004
 
LOCKHEED MARTIN CORPORATION (1)
* 4,894,115 Laser beam scanning method for forming via holes in polymer materials 133 1989
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 5,059,759 Laser beam machine 11 1990
 
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (1)
* 2010/0320,179 Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same 0 2008
 
ROHM CO., LTD. (1)
* 7,939,429 Nitride semiconductor device and method of manufacturing the same 0 2008
 
ROLLS-ROYCE PLC (1)
* 4,992,025 Film cooled components 43 1989
 
SOLYNDRA LLC (1)
* 2008/0029,152 Laser scribing apparatus, systems, and methods 30 2006
 
TECHNOLINES, LLC (1)
* 5,916,461 System and method for processing surfaces by a laser 25 1997
* Cited By Examiner

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