US Patent Application No: 2012/0132,629

Number of patents in Portfolio can not be more than 2000

METHOD AND APPARATUS FOR REDUCING TAPER OF LASER SCRIBES

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods and apparatuses for reducing taper of a laser scribe in a substrate are described. One method includes aiming a laser beam at a surface of the substrate in a first direction perpendicular to a first cutting direction of the beam and aiming it at the surface in a second direction perpendicular to the first cutting direction. In each position, the laser beam is tilted at a beam tilt angle with respect to a line perpendicular to the surface. A single scribe line is formed in the surface by applying the laser beam to the surface while aiming the laser beam in the first direction and cutting in the first cutting direction and applying the laser beam to the surface while aiming the laser beam in the second direction and cutting in one of the first cutting direction and a second cutting direction opposite the first cutting direction.

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Patent Owner(s)

  • ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Frankel, Joseph G Beaverton, US 3 0
O'Brien, James N Bend, US 10 425

Cited Art Landscape

Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (24)
* 4,941,082 Light beam positioning system 41 1988
* 4,894,115 Laser beam scanning method for forming via holes in polymer materials 147 1989
* 4,992,025 Film cooled components 49 1989
* 5,059,759 Laser beam machine 15 1990
* 5,194,711 Cutting using high energy radiation 6 1991
* 5,916,461 System and method for processing surfaces by a laser 29 1997
* 6,420,245 Method for singulating semiconductor wafers 52 2001
* 2002/0031,899 Apparatus and method for singulating semiconductor wafers 36 2001
* 6,772,514 Method of machining glass substrate and method fabricating high-frequency circuit 5 2001
* 6,586,707 Control of laser machining 23 2001
* 6,992,026 Laser processing method and laser processing apparatus 183 2003
* 2004/0017,430 Laser processing method and laser processing apparatus 6 2003
* 2004/0164,060 HOLE DRILLING METHOD AND APPARATUS 8 2004
* 2005/0070,075 Laser beam processing method and laser beam machine 0 2004
* 7,364,986 Laser beam processing method and laser beam machine 83 2004
* 2005/0277,270 Wafer processing method 5 2005
* 7,473,866 Laser processing apparatus 85 2006
* 2008/0029,152 Laser scribing apparatus, systems, and methods 69 2006
* 7,939,429 Nitride semiconductor device and method of manufacturing the same 0 2008
* 2009/0057,282 Laser machining method utilizing variable inclination angle 4 2008
* 2010/0320,179 Method for Creating Trench in U Shape in Brittle Material Substrate, Method for Removing Process, Method for Hollowing Process and Chamfering Method Using Same 4 2008
* 8,338,745 Apparatus and methods for drilling holes with no taper or reverse taper 0 2009
* 2011/0132,881 APPARATUS AND METHODS FOR DRILLING HOLES WITH NO TAPER OR REVERSE TAPER 0 2009
* 8,364,304 Methods and apparatus for laser scribing wafers 2 2010
* Cited By Examiner

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (1)
* 2015/0059,411 METHOD OF SEPARATING A GLASS SHEET FROM A CARRIER 0 2014
* Cited By Examiner