US Patent Application No: 2012/0134,028

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WAFER LEVEL LENS, PRODUCTION METHOD OF WAFER LEVEL LENS, AND IMAGING UNIT

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Abstract

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A sufficient light-shielding property is obtained by a wafer level lens having at least one lens module having a substrate and a plurality of lenses formed on the substrate in which the wafer level lens has a black resist layer formed on the surface of the lens module or on the surface of the substrate and the black resist layer is formed with a pattern having an opening at a part intersecting the optical axis of the lens, and generation of defects such as ghosts, flares and the like due to a reflected light can be prevented and an increase in the production cost can be suppressed.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
FUJIFILM CORPORATIONTOKYO18570

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Yoichi Kanagawa, JP 48 116

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