US Patent Application No: 2012/0138,662

WIRE BONDING METHOD

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Jun 7, 2012
Publication date
Feb 9, 2012
filing date
13/370,047
serial no
Published
status

Importance

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Abstract

According to an aspect of an embodiment, a wire bonding method includes vibrating a capillary of a bonding head, the capillary having a heater attached thereto at a position corresponding to a node of vibration of the capillary generated by the vibration heating the capillary with the heater and performing a wire bonding operation while heating the capillary with the heater.

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First Claim

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Patent Owner(s)

Patent Owner	Address	Total Patents
FUJITSU LIMITED	KAWASAKI	21511

International Classification(s)

B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Matsumura, Takayoshi	Kawasaki, JP	57	105

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