MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jun 7, 2012
app pub date -
Jan 12, 2011
filing date -
Dec 3, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.
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