Via structure, method for forming the via structure, and circuit board with the via structure and method for manufacturing the circuit board
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United States of America Patent
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Issued Date -
Jun 14, 2012
app pub date -
Apr 8, 2011
filing date -
Dec 8, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Disclosed herein is a via structure with a conductive via. There is provided a via structure, including: a substrate laminate having a multilayer structure and a via hole penetrating through the multilayer structure; a first circuit pattern formed on one surface of the substrate laminate; a second circuit pattern formed on the other surface of the substrate laminate; and a conductive via formed in the via hole and having one end connected to the first circuit pattern and the other end connected to the second circuit pattern, wherein the multilayer structure includes resin layers having different etching rates using an alkaline solution.
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