HEAT DISSIPATION AND TEMPERATURE-HOMOGENIZING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME
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United States of America Patent
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N/A
Issued Date -
Jun 14, 2012
app pub date -
Dec 6, 2011
filing date -
Dec 10, 2010
priority date (Note) -
Abandoned
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Abstract
A heat dissipation and temperature-homogenizing structure which includes a body made of a material with low thermal conductivity and a heat conducting member made of a material with high thermal conductivity is disclosed. The body has opposite inner surfaces and outer surfaces. The heat conducting member is embedded inside the body and is completely surrounded between the inner surfaces and the outer surfaces. When the electronic device generates heat, the heat is firstly transferred to the heat conducting member from the inner surfaces, and then rapidly and evenly spreads over the heat conducting member. Finally, the heat inside the heat conducting member is uniformly dissipated through the outer surfaces. Accordingly, the heat dissipation and temperature-homogenizing structure may effectively and evenly spread the heat over the outer surfaces for exchanging heat with the ambient.
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