METHOD AND DEVICE FOR PRODUCING THIN SILICON RODS

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United States of America Patent

SERIAL NO

13316672

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Abstract

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A method for producing thin silicon rods includes: a) providing a rod of silicon; b) sequentially cutting with a sawing device slabs from the rod, wherein the rod is respectively rotated axially through 90° or 180° between two successive cuts so that two of four successive cuts respectively take place pairwise on radially opposite sides of the rod or wherein slab cutting takes place simultaneously together at radially opposite sides of the rod; and c) sawing the cut slabs into thin rods having a rectangular cross section. A device for producing thin rods from a silicon rod by sawing, contains a first unit with cutting tools and a cutting tool cooling liquid, a second unit having nozzles for introducing additional cooling liquid into cutting kerfs of the workpiece, and a third unit having a band saw, a wire saw or cutting tools containing one or more shafts.

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Patent Owner(s)

Patent OwnerAddress
WACKER CHEMIE AG81737 MÜNCHEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LICHTENEGGER, Bruno Emmerting, DE 8 94
SCHANTZ, Matthaeus Reut, DE 4 39

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