POLISHING COMPOSITION

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United States of America Patent

SERIAL NO

13407633

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Abstract

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To provide a polishing composition which can satisfy both suppression of the surface topography and a high stock removal rate, in a polishing step in the production of a wiring structure.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATED1-1 CHIRYO 2-CHOME NISHIBIWAJIMA-CHO KIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRANO, Tatsuhiko Kiyosu-shi, JP 23 224
Mizuno, Hiroshi Kiyosu-shi, JP 277 2827
Umeda, Takahiro Kiyosu-shi, JP 30 129

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