OPTICAL APERTURES AND APPLICATIONS THEREOF
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United States of America Patent
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Issued Date -
Jun 21, 2012
app pub date -
Dec 16, 2010
filing date -
Dec 16, 2010
priority date (Note) -
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Abstract
In one aspect, the present invention provides wafer level optical assemblies comprising one or more optical apertures spaced apart from optical wafers and/or optical wafer substrates. In some embodiments, a wafer level assembly described herein comprises a first wafer comprising a first perforation and a first aperture aligned with the first perforation and coupled to the first wafer.
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