ADAPTIVE THERMAL GAP PAD
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United States of America Patent
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Issued Date -
Jun 21, 2012
app pub date -
Dec 20, 2010
filing date -
Dec 20, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a thermal gap pad for transferring heat from a heat-supplying component such as an electronic device, and more specifically to a thermal gap pad with reduced compressive loading. In one embodiment, a thermal assembly includes a heat-supplying component, a cooling structure, a gap pad having a first surface, and a lubricant provided along the first surface of the gap pad. The lubricant has a viscosity of about 500 cP or less. The gap pad is compressed between the heat-supplying component and the cooling structure, such that the first surface of the gap pad is in thermal contact with the cooling structure.
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