Solution and process for activating the surface of a semiconductor substrate

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United States of America Patent

PATENT NO 9181623
APP PUB NO 20120156892A1
SERIAL NO

13390208

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Abstract

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A solution and a process are used for activating the surface of a substrate comprising at least one area formed from a polymer, for the purpose of subsequently covering it with a metallic layer deposited via an electroless process. The composition contains: A) an activator formed from one or more palladium complexes; B) a binder formed from one or more organic compounds chosen from compounds comprising at least two glycidyl functions and at least two isocyanate functions; and C) a solvent system formed from one or more solvents capable of dissolving said activator and said binder. The solution and process may be applied for the manufacture of electronic devices such as integrated circuits, especially in three dimensions.

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Patent Owner(s)

  • ALCHIMER

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mevellec, Vincent Boulogne Billancourt, FR 16 57
Suhr, Dominique Chatenay Malabry, FR 10 28

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