Wide Sheet Wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Jun 28, 2012
app pub date -
Jan 27, 2011
filing date -
Dec 22, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sheet wafer has a generally flat, generally rectangular shaped body with a length and a width, and first and second filaments generally perpendicular to the width of the body. The first and second filaments are at least partially encapsulated by a wafer material and, together with the wafer material, form at least a portion of the body. The width is between about 145 mm and 165 mm.
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