ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLECULAR SYSTEM
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United States of America Patent
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Issued Date -
Jul 5, 2012
app pub date -
Mar 23, 2009
filing date -
Mar 21, 2008
priority date (Note) -
Abandoned
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Abstract
An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.
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