APPARATUS AND METHOD FOR FORMING AN APERTURE IN A SUBSTRATE
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United States of America Patent
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app pub date -
Jan 4, 2012
filing date -
Jan 5, 2011
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Abandoned
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Abstract
A method of forming an aperture in a substrate having a first side and a second side opposite the first side includes irradiating the substrate with a laser beam to form a laser-machined feature within the substrate and having a sidewall. The sidewall is etched with an etchant to change at least one characteristic of the laser-machined feature. The etching can include introducing the etchant into the laser-machined feature from the first side and the second side of the substrate. An apparatus and system for forming an aperture are also disclosed.
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