CIRCUIT BOARD FRAME WITH INTEGRAL HEAT SINK FOR ENHANCED THERMAL TRANSFER
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United States of America Patent
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N/A
Issued Date -
Jul 5, 2012
app pub date -
Dec 29, 2010
filing date -
Dec 29, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A circuit board frame and a circuit board assembly that includes the circuit board frame includes a first region designed for receiving a circuit board, and a second region contiguous with the first region and including a heat sink. The circuit board frame and circuit board assembly are designed and fabricated so that the first region is located inside a circuit board chassis and the heat sink is located outside the circuit board chassis when the circuit board frame or the circuit board assembly is assembled into the circuit board chassis by insertion into at least one slot within a sidewall of the circuit board chassis. The at least one slot within the sidewall of the circuit board chassis may have straight sidewalls, or alternatively tapered sidewalls that may ease insertion and assembly of the circuit board frame or circuit board assembly into the circuit board chassis. Protrusion of the heat sink, which is contiguous with the first region, through the circuit board chassis sidewall improves thermal transfer efficiency from a circuit board to the heat sink in-part via reduction of thermal transfer inhibiting interfaces.
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