Thermoelectric Modules, Thermoelectric Assemblies, and Related Methods

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United States of America Patent

APP PUB NO 20120174956A1
SERIAL NO

13361668

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An example thermoelectric module generally includes a first laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, a second laminate having a dielectric layer and an electrically conductive layer coupled to the dielectric layer, and thermoelectric elements disposed generally between the first and second laminates. At least one of the dielectric layers is a polymeric dielectric layer. The electrically conductive layers of the first and second laminates are at least partially removed to form electrically conductive pads on the respective first and second laminates. The thermoelectric elements are coupled to the electrically conductive pads of the first and second laminates for electrically coupling the thermoelectric elements together. Also disclosed is an exemplary articulated thermoelectric assembly that generally includes rigid upper laminates, thermoelectric elements mechanically and electrically coupled to each upper laminate, and an articulated lower substrate mechanically and electrically coupled to the thermoelectric elements.

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Patent Owner(s)

Patent OwnerAddress
LAIRD TECHNOLOGIES INC16401 SWINGLEY RIDGE ROAD SUITE 700 CHESTERFIELD MO 63017

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hershberger, Jeffrey Gerard Shaker Heights, US 7 149
Hill, Richard F Parkman, US 44 933
Smythe, Robert Michael Cleveland, US 11 272

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