ROBOTIC PLACEMENT MACHINE FOR OPTICAL BONDING, SYSTEM AND METHOD OF USE THEREOF
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United States of America Patent
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Issued Date -
Jul 19, 2012
app pub date -
Jan 19, 2011
filing date -
Jan 19, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A robotic placement machine including a base operably connected to the Y axis actuator and the X axis actuator, a first Z axis actuator coupled to the first end of the base, the first Z axis actuator capable of moving up and down a first Z axis, a second Z axis actuator coupled to the second end of the base, the second Z axis actuator capable of moving up and down a second Z axis, and a pick and place plate operably connected to the first Z axis actuator and the second Z axis actuator, wherein the first Z axis actuator and the second Z axis actuator are each capable of moving independently of each other to tilt the pick and place plate is provided. Furthermore, a system comprising a first machine, second machine, and third machine to eliminate air bubbles when bonding two substrates is also provided. A method of optical bonding is further provided.
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