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Abstract

A plasma etching apparatus includes a magnetic field forming section, which has concentrically disposed magnetic field coils at least at three levels, and which forms, on the inner side of the magnetic field coil at the intermediate level, an annular zero magnetic field region along the circumferential direction of the magnetic field coils. A chamber main body including the top portion is interpolated on the inner side of the magnetic field coils and houses the substrate below the zero magnetic field region. A gas supply section supplies an etching gas to the inside of the chamber main body. A high frequency antenna forms an induction electric field in the zero magnetic field region and generates plasma of the etching gas. An electrode is disposed above the top portion of the chamber main body, and is electrostatically coupled with the plasma generated in the chamber main body.

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First Claim