US Patent Application No: 2012/0187,083

Number of patents in Portfolio can not be more than 2000

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

ALSO PUBLISHED AS: 8883653

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An inventive substrate treatment method includes a silylation step of supplying a silylation agent to a substrate, and an etching step of supplying an etching agent to the substrate after the silylation step. The method may further include a repeating step of repeating a sequence cycle including the silylation step and the etching step a plurality of times. The cycle may further include a rinsing step of supplying a rinse liquid to the substrate after the etching step. The cycle may further include a UV irradiation step of irradiating the substrate with ultraviolet radiation after the etching step. The method may further include a pre-silylation or post-silylation UV irradiation step of irradiating the substrate with the ultraviolet radiation before or after the silylation step.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
DAINIPPON SCREEN MFG. CO., LTD.KYOTO679

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashizume, Akio Kyoto, JP 30 27

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
* 4,803,181 Process for forming sub-micrometer patterns using silylation of resist side walls 70 1987
* 4,871,418 Process for fabricating arbitrarily shaped through holes in a component 25 1988
 
TOKYO ELECTRON LIMITED (2)
* 2010/0099,256 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS 2 2009
* 2012/0264,308 ETCHING METHOD, ETCHING APPARATUS AND STORAGE MEDIUM 2 2012
 
EUV LLC (1)
* 6,673,525 Thin layer imaging process for microlithography using radiation at strongly attenuated wavelengths 1 2000
 
FUJITSU LIMITED (1)
* 4,349,609 Electronic device having multilayer wiring structure 67 1980
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SCREEN Holdings Co., Ltd. (1)
* 8,883,026 Substrate processing method and substrate processing apparatus 0 2012
 
TOKYO ELECTRON LIMITED (1)
* 8,597,401 Exhausting method and gas processing apparatus 0 2011
* Cited By Examiner