METHOD AND APPARATUS FOR WAFER SUPPORT
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United States of America Patent
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Issued Date -
Jul 26, 2012
app pub date -
Mar 30, 2012
filing date -
Jul 8, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An end effector having a first arm and a second arm extending from an end effector support body is provided. The first arm and the second arm each have support extensions for supporting a peripheral region of a substrate on opposing sides of a diameter of the substrate. The height of support contacts on opposing sides of the diameter is different relative to a horizontal datum plane. In one embodiment, the end effector includes additional arms extending from the end effector support body. A system for supporting a substrate is provided also.
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