Reduction of edge chipping during wafer handling

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8753460
APP PUB NO 20120193014A1
SERIAL NO

13015638

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Abstract

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Methods and systems for reinforcing the periphery of a semiconductor wafer bonded to a carrier are disclosed. In one embodiment, additional adhesive is applied to the semiconductor wafer prior to bonding. The additional adhesive seeps into a crevice between the carrier and wafer and provides reinforcement. In another embodiment, adhesive is applied to the crevice by a dispenser after the wafer is bonded to the glass carrier.

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Patent Owner(s)

Patent OwnerAddress
ELPIS TECHNOLOGIES INC1891 ROBERSTON ROAD SUITE 100 OTTAWA K2H 5B7

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Griffith, Jonathan H Hopewell Junction, US 24 322
Knickerbocker, Sarah H Hopewell Junction, US 39 655

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