SUBSTRATE COOLING DEVICE, SPUTTERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
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app pub date -
Apr 4, 2012
filing date -
Oct 5, 2009
priority date (Note) -
Abandoned
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Abstract
A substrate cooling device includes: a substrate holding stage including a recess defining a space between a substrate mounting unit and a substrate mounted on the substrate mounting unit; a holding member that exerts a pressing force against the substrate holding stage so as to fix the substrate to the substrate holding stage; a refrigerator connected to the substrate holding stage; a coolant gas inlet path including a coolant gas inlet opening that is provided at the substrate holding stage and opens to a recessed face of the recess, the coolant gas inlet path connecting a space in the recess via the coolant gas inlet opening to a coolant gas supply; and a coolant gas outlet path including a coolant gas outlet opening that is provided at the substrate holding stage independently of the coolant gas inlet opening and opens to the recessed face of the recess.
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