STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES
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United States of America Patent
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Issued Date -
Aug 2, 2012
app pub date -
Jan 28, 2011
filing date -
Jan 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present technology discloses a stacked die package. In one embodiment, a package comprises a first die, a second die, and a leadframe. The first die is electrically coupled to the bottom surface of the leadframe through contact bump/bumps. The second die is electrically coupled to the top surface of the leadframe through wirebond/wires. The second die is mounted on the top surface of the first die.
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