TEMPERATURE SENSOR USING TEMPERATURE SENSING DEVICES
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United States of America Patent
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Issued Date -
Aug 2, 2012
app pub date -
Feb 2, 2012
filing date -
Jul 31, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present subject matter relates generally to temperature sensors using one or a plurality of temperature sensing devices. Various embodiments of the present subject matter include a temperature sensor assembly. The temperature sensor assembly includes an enclosure having an inside surface and a temperature sensing device housed in the enclosure. A thermally conductive material connects a surface of the temperature sensing device directly to the inside surface of the enclosure in a side mounted manner to provide rapid thermal conduction from the enclosure to the temperature sensing device. In various embodiments, the temperature sensing device is a resistance temperature detector (RTD).
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