PACKAGE WITH HEAT SCORE
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United States of America Patent
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app pub date -
Dec 29, 2011
filing date -
Dec 30, 2010
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Abstract
The present invention addresses certain problems facing flexible packages and the packaging industry. Embodiments of the present invention are directed to a method of heat scoring the film or material of the package in various shapes and locations to facilitate the consumer opening the package. Embodiments are also directed to a heat scoring device for delivering the heat score to the package material during the manufacturing process. Other embodiments are directed to a package having one or more heat scores for permitting a user to easily access the contents of a package while maintaining the integrity of the package.
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