Circuit assemblies including thermoelectric modules
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United States of America Patent
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Feb 11, 2014
Grant Date -
Aug 9, 2012
app pub date -
Feb 5, 2011
filing date -
Feb 5, 2011
priority date (Note) -
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Abstract
A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board for use as a heat pump in the circuit assembly. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
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