Mezzanine connector
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United States of America Patent
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-
Feb 25, 2014
Grant Date -
Aug 9, 2012
app pub date -
Feb 2, 2012
filing date -
Feb 2, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A two-piece mezzanine connector for high speed, high density signals. The connector is assembled from wafers that may be formed of identical wafer halves. The halves may have interior portions that form a channel in which a lossy member may be captured for selectively configuring the connector for high frequency performance. The lossy member may be serpentine, to both provide different spacing relative to signal and ground conductors and to provide compliance to press against ground conductors when captured between wafer halves. Instead of, or in addition to, the lossy member captured between two wafer halves, the wafer halves may each have lossy material overmolded on at least one side, so that an assembled wafer may have lossy material disposed on the outside. The wafers may have dovetail projections that are secured within dovetail channels, forming structural members of the connector.
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