Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component
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United States of America Patent
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Jul 29, 2014
Grant Date -
Aug 23, 2012
app pub date -
Apr 20, 2012
filing date -
Nov 4, 2010
priority date (Note) -
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Abstract
A method is provided for facilitating cooling of an electronic component. The method includes: providing a refrigerant loop configured for refrigerant to flow through the loop; coupling a compressor in fluid communication with the loop, wherein a first portion of the loop resides upstream of a refrigerant inlet of the compressor, and a second portion resides downstream; and disposing a controllable thermoelectric array in thermal communication with the refrigerant loop. The thermoelectric array is disposed with the first portion of the refrigerant loop at least partially in thermal contact with the first side of the array, and the second portion of the loop at least partially in thermal contact with a second side of the array. The array is controlled to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.
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