HEAT SINK EQUIPPED WITH A VAPOR CHAMBER
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United States of America Patent
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N/A
Issued Date -
Aug 23, 2012
app pub date -
Feb 17, 2011
filing date -
Feb 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat sink equipped with a vapor chamber includes a heat conduction plate and a vapor chamber. The heat conduction plate has one side formed integrally a plurality of radiation fins and another side with two lateral edges formed respectively and integrally a fastening portion. The two fastening portions are interposed by a recess to bond the vapor chamber. Each fastening portion is fastened to a printed circuit board through at least one screw to allow the vapor chamber to contact a heat generation element. The fastening portion is integrally formed at a desired thickness, thus has sufficient strength to withstand the fastening force of the screw to prevent tight sealing between the vapor chamber and heat generation element affected by deformation of the heat conduction plate. Thereby the vapor chamber can smoothly contact the heat generation element to rapidly transfer heat outside.
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