Package Substrate and Method for Forming the Same
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United States of America Patent
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N/A
Issued Date -
Aug 23, 2012
app pub date -
May 19, 2011
filing date -
Feb 21, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A package substrate is disclosed. The package substrate includes a substrate body having a conductive portion, a plurality of insulation portions and two surfaces opposing to each other; and a plurality of bonding layers for heat dissipation formed on the two surfaces of the substrate body, conducted via the conductive portion and separated from one another by the insulation portions. A method for forming the package substrate is also disclosed.
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