Semiconductor package including multiple chips and separate groups of leads
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United States of America Patent
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May 13, 2014
Grant Date -
Aug 30, 2012
app pub date -
May 7, 2012
filing date -
Mar 17, 2009
priority date (Note) -
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Abstract
Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
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